Breadboard 830 Tie Point

35.00 EGP

The BB-01 Solderless Breadboard (830 Tie Points) is an essential, simple tool for quickly and easily building and testing electronic circuits and prototypes without the need for soldering. **Technical Specifications** **Total Tie Points:** 830 points (630 points for components and ICs + 200 points for power rails). **Pitch:** 2.54 mm (0.1 inch) – standard spacing compatible with integrated circuits (ICs) and Arduino sensors. **Compatible Wire Gauge:** AWG 21 to AWG 26 (standard jumper wires). **Housing Material:** Durable, electrically insulating ABS plastic. **Internal Contacts:** Nickel-plated phosphor bronze clips ensuring stability and reliable connectivity. **Dimensions:** Approximately 165 mm x 55 mm x 8.5 mm. **Key Features** **Rapid Assembly & Modification:** Allows for the easy insertion and removal of components and flexible circuit adjustments during testing. **Color-Coded Power Rails:** Features two full-length side rails with color coding (red for positive +, blue/black for negative -) to simplify and organize circuit power connections. **Self-Adhesive Backing:** Equipped with double-sided tape on the bottom for easy mounting onto robotics project surfaces or test platforms. **Expandability:** Features interlocking tabs and slots, allowing multiple breadboards to be connected side-by-side to expand the workspace for larger circuits. Common Uses Prototyping electronic circuits. Connecting and testing microcontrollers (such as Arduino and ESP32) with various sensors and chips. Educational experiments, student projects, and electronics hobbyist activities. Operational Note On some 830-point breadboard models, the side power rails are split in the middle to allow for greater flexibility in supplying different voltages. If you notice a gap in the center, you can insert a small jumper wire to connect the two halves and ensure continuous power flow along the entire length of the rail.